Hemeixin Electronics Co.,Ltd

Date: 22nd December 2015
PCB Assembly
Flex, rigid flex, and rigid PCB form factors
SMT, through-hole, and mixed technology
Board sizes up to 18” x 14”
Complex, high density assemblies
PBGA, CBGA, TBGA, FPGA, CGA, LGA
Package on Package (PoP) assembly
Micro BGA (0.4mm)
0402s, 0201s, 01005s
Wave and selective solde
http://www.hemeixinpcb.com
Contact Information
Phone:
86-0755-27586529
Fax:

86-0755-27934435

Address:

South of 5th Floor, Building 7,Wanxia Industrial Park, Tongfuyu Industrial Area, Shajing Town, Baoan District,
shenzhen,

Website:

www.hemeixinpcb.com

Contact Form